Abstract：The paper uses research methods of the cross discipline,taking the information technology progress of the electronic paste technology as an example,to do a comprehensive comparison analysis of environmental risks generated from the life cycle process of the new technology products .It finds that the new technology application of electronic paste can improve electronic and electrical properties,but it may bring new and even greater environmental risks from the subjective and objective aspects.The interested parties should focus on this issue and make a countermeasure in advance.The paper observes the control strategy of environmental risk,and puts forward some suggestions for China to improve the sustainable development between technology and environment.
刘宏钊,陈立桥. 当代新技术发展中的环境风险控制——以电子浆料技术为例[J]. 中国科技论坛, 2016(4): 25-29.
Liu Hongzhao,Chen Liqiao. Environmental Risk Control in the Development of Modern New Technology-Taking Electronic Paste Technology as An Example. , 2016(4): 25-29.
[1]刘大椿,何立松.现代科技导论[M].北京:中国人民大学出版社,1998:148. [2]SIRE C,ARDIACA F,LEPILLIET S,SEO J W T,HERSAM M C,DAMBRINE G,HAPPY H,DERYCKE V.Flexible gigahertz transistors derived from solution-based single-layer grapheme[J].Nano letters,2012(12):1184-1188. [3]http://www.giiresearch.com/press/nan205729.shtml [4]ASGHARI S,JOHARI S,LEE J,KIM Y,JEON Y,CHOI H,MOON M,YU I.Toxicity of various silver nanoparticles compared to silver ions in Daphnia magna[J].Journal of nanobiotechnology,2012(10):14. [5]LEEKwi-jong J B H,LEEYong-Ho,et al.Metal nanoparticle and method for manufacturing the mandconductive ink[P].USPat:20060254387,2006-11-16. [6]TOLAYMAT T M,EL BADAWY A M,GENAIDY A,SCHECKEL K G,LUXTON T P,SUIDAN M.An evidence-based environmental perspective of manufactured silver nanoparticle in syntheses and applications:A systematic review and critical appraisal of peer-reviewed scientific papers[J].Science of the total environment,2010(408):999-1006. [7]EOM Y S,CHOI K S,MOON S H,PARK J H,LEE J H,MOON J T.Characterization of a hybrid Cu paste as an isotropic conductive adhesive[J].ETRI journal,2011(33):864-870. [8]SONGPING W.Preparation of ultra fine nickel-copper bimetallic powder for BME-MLCC[J].Microelectronics journal,2007(38):41-46. [9]HUANG G Y,XU S M,XU G,Li L.Y,ZHANG L.F.Preparation of fine nickel powders via reduction of nickel hydrazine complex precursors[J].Transactions of nonferrous metals society of China,2009(19):389-393. [10]KIM K H,LEE Y B,CHOI E Y,PARK H C,PARK S S.Synthesis of nickel powders from various aqueous media through chemical reduction method[J].Materials chemistry and physics,2004(86):420-424. [11]HAITAO Z,CANYING Z,YANSHENG Y.Novel synthesis of copper nanoparticles:influence of the synthesis conditions on the particle size[J].Nanotechnology,2005(16):3079. [12]LEE Y I,KIM S,JUNG S B,MYUNG N V,CHOA Y H.Enhanced electrical and mechanical properties of silver nanoplatelet-based conductive features direct printed on a flexible substrate[J].ACS applied materials & interfaces,2013(5):5908-5913. [13]KETKAR S A,UMARJI G G,PHATAK G J,AMBEKAR J D,RAO I C,MULIK U P,Amalnerkar D P.Lead-free photoimageable silver conductor paste formulation for high density electronic packaging[J].Materials science and engineering:B,2006(132):215-221. [14]SONGPING W.Preparation of micron size flake silver powders for conductive thick films[J].J mater sci:mater electron,2007(18):447-452. [15]TAN F,QIAO X,CHEN J.Removal of chemisorbed lubricant on the surface of silver flakes by chemicals[J].Applied surface science,2006(253):703-707. [16]TAKAYUKI Anzai,et al.//Safety Evaluation for Nanomaterials,2012,15(2):17-29. [17]FALKNER ROBERT,JASPERS Nico.Regulating nanotechnologies:risk,uncertainty and the global governance gap[J].Global environmental politics,2012,12(1):30-55. [18]刘凤元.欧美高科技风险应对策略及对我国的启示[J].中国科技论坛,2007(7):118-121.
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